Abstract: Featured ApplicationInclusion of the electromagnetic compatibility analysis in the design phase of the production flux of high-speed integrated circuits. AbstractThis paper deals with the electromagnetic compatibility (EMC) issues related to the direct and radiated emissions from a high-speed integrated circuits (ICs). These emissions are evaluated here by means of circuital and electromagnetic models. As for the conducted emission, an equivalent circuit model is derived to describe the IC and the effect of its loads (package, printed circuit board, decaps, etc.), based on the Integrated Circuit Emission Model template (ICEM). As for the radiated emission, an electromagnetic model is proposed, based on the superposition of the fields generated in the far field region by the loop currents flowing into the IC and the package pins. A custom experimental setup is designed for validating the models. Specifically, for the radiated emission measurement, a custom test board is designed and realized, able to highlight the contribution of the direct emission from the IC, usually hidden by the indirect emission coming from the printed circuit board. Measurements of the package currents and of the far-field emitted fields are carried out, providing a satisfactory agreement with the model predictions.Keywords: electromagnetic compatibility; integrated circuits; EMI modeling; conducted emission; radiated emission
Electromagnetic Compatibility of Integrated Circuits: Techniques for Low Emission and Susceptibility focuses on the electromagnetic compatibility of integrated circuits. The basic concepts, theory, and an extensive historical review of integrated circuit emission and susceptibility are provided. Standardized measurement methods are detailed through various case studies. EMC models for the core, I/Os, supply network, and packaging are described with applications to conducted switching noise, signal integrity, near-field and radiated noise. Case studies from different companies and research laboratories are presented with in-depth descriptions of the ICs, test set-ups, and comparisons between measurements and simulations. Specific guidelines for achieving low emission and susceptibility derived from the experience of EMC experts are presented.
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Compared to conventional approaches that use discrete transformers, the integration of a transformer and circuitry into a chip scale package will lead to greatly improved PCB space-saving due to the reduction in the number of components, but may introduce higher radiated emissions. Radiated emissions mitigation techniques may negate the savings of the integrated transformer and cost due to added PCB design complexity or additional components.
The design techniques for power line fields are usually instrumentation oriented, and include local shielding and filtering of the most critical circuits. The design techniques necessary for EMI emissions and immunity also minimize this threat. This is normally not a serious threat.
The design techniques for radiated emissions are to suppress the emissions at the source by careful circuit layout, filtering, and grounding, or to confine the emissions by shielding. For automotive designs, the emphasis has usually been on suppression and careful circuit layout, since shielding is costly and difficult for most high volume automotive products. Nevertheless, shielding use is increasing in vehicular applications.
The parameters and functional requirements dependlargely on the type of equipment designed. The design parameter that mostaffects reliability is the thermal architecture of theequipment. The requirements are the maximum and minimum ambient operatingtemperatures. EMC requirements are divided into immunityand emissions . Emission limits and immunity parameters aredefined in the corresponding EMC standards . CEM designimprovements consist of inserting components such as filters and othertechniques such as good printed circuit design and wiring.
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